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回流焊工艺条件及器件状态对表面贴装器件热翘曲变形的影响
Release time:2022-06-01  Hits:
Project Number:
20220002
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功率器件封装烧结互连工艺开发及可靠性研究
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物性参数对功率器件芯片/基板互连可靠性的影响研究