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吴丰顺
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功率器件封装烧结互连工艺开发及可靠性研究
Release time:2023-06-21  Hits:
Project Number:
20231581
Pre One::
三维堆叠集成电路电源完整性建模和仿真
Next One::
回流焊工艺条件及器件状态对表面贴装器件热翘曲变形的影响