·Paper Publications
Liping Mo, Chaowei Guo, Zheng Zhou, Fengshun Wu, Changqing Liu. Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test. Journal of Materials Science: Materials in Electronics, 2018. 29(7):100-108. https://doi.org/10.1007/s10854-018-9293-8. (SCI 期刊)
Release time:2018-07-01 Hits:
Included Journals: SCI
Document Type: J