·Paper Publications
L. Mo, Z. Chen, F. Wu, and C. Liu. Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition. Intermetallics, 2015, Vol.66, pp: 13-21. （SCI期刊）
Release time:2018-07-01 Hits:
Included Journals: SCI
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Pre One:：
Chen, Guang; Liu, Li; Du, Juan; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun. Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles. Journal of Materials Science, v 51, n 22, p 10077-10091, November 1, 2016
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Next One:：
Liping Mo, Chaowei Guo, Zheng Zhou, Fengshun Wu, Changqing Liu. Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test. Journal of Materials Science: Materials in Electronics, 2018. 29(7):100-108. https://doi.org/10.1007/s10854-018-9293-8. (SCI 期刊)