·Paper Publications
Chen, Guang; Wu, Fengshun; Liu, Changqing; Xia, Weisheng; Liu, Hui. Effects of fullerenes reinforcement on the performance of 96.5Sn-3Ag-0.5Cu lead-free solder. Materials Science and Engineering A, v 636, p 484-492, June 01, 2015
Release time:2018-07-01 Hits:
Included Journals: SCI
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Pre One:：
Chen, Guang ; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. Journal of Alloys and Compounds, v 656, p 500-509, January 25, 2016
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Next One:：
Chen, Guang ; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun. Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing. Journal of Alloys and Compounds, v 685, p 680-689, November 15, 2016