·Paper Publications
Chen, Guang ; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. Journal of Alloys and Compounds, v 656, p 500-509, January 25, 2016
Release time:2018-07-01 Hits:
Included Journals: SCI
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Pre One:：
Peng, Hao; Chen, Guang; Mo, Liping; Chan, Y.C.; Wu, Fengshun; Liu, Hui. An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints. Journal of Materials Science: Materials in Electronics, v 27, n 9, p 9083-9093, September 1, 2016
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Next One:：
Chen, Guang; Wu, Fengshun; Liu, Changqing; Xia, Weisheng; Liu, Hui. Effects of fullerenes reinforcement on the performance of 96.5Sn-3Ag-0.5Cu lead-free solder. Materials Science and Engineering A, v 636, p 484-492, June 01, 2015