中文
HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY

吴丰顺

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Patents

Current position: 英文主页 > Scientific Research > Patents
一种微流控芯片的封装方法. CN105268490B，2018.01.05
Release time:2018-07-01  Hits:

Patent Applicant: 吴丰顺 ; 祝温泊等

Copyright © 2017 Huazhong University of Science & Technology

Click: | The Founding Time:.. | The Last Update Time:..

MOBILE Version