中文
HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY

吴丰顺

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Patents

Current position: 英文主页 > Scientific Research > Patents
一种MEMS器件的封装方法. CN103224218B, 2016.01.20
Release time:2018-07-01  Hits:

Patent Applicant: 吴丰顺 ; 祝温泊等

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