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HUAZHONG UNIVERSITY OF SCIENCE & TECHNOLOGY

吴丰顺

Recommended Ph.D.Supervisor Recommended MA Supervisor

·Patents

Current position: 英文主页 > Scientific Research > Patents
一种IC智能卡焊接电极夹头. CN202155622U，2012.03.07
Release time:2018-07-01  Hits:

Patent Applicant: 吴丰顺，舒强等

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