华中科技大学主页平台管理系统吴丰顺--中文主页-- Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y.C.; Tang, Zirong; Wu, Fengshun. An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering and Surface Mount Technology, v 28, n 2, p 84-92, 2016

吴丰顺

102

同专业博导同专业硕导

个人信息

Personal information

教授博士生导师硕士生导师

性别：男

在职信息：在职

所在单位：材料科学与工程学院

学历：研究生(博士)毕业

学位：工学博士学位

学科：材料加工工程

论文成果

中文主页 - 科学研究 - 论文成果

Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y.C.; Tang, Zirong; Wu, Fengshun. An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering and Surface Mount Technology, v 28, n 2, p 84-92, 2016

发布时间：2018-07-01 点击次数：

收录刊物：SCI

上一条：
Tao Cui, Hai Jin, Xiaofei Liao, and Haikun Liu, “A Virtual Machine Replay System Based on Paravirtualized Xen”, Proceedings of the 2009 6th IFIP International Conference on Network and Parallel Computing (NPC’09), IEEE Computer Society, October 19-21, 2009, Gold Coast, Australia, pp.44-50. (EI indexed)
下一条：
Haikun Liu, Hai Jin, Tao Cui, and Xiaofei Liao. “Research on Virtual Machine based Full System Replay”, Journal of Frontier of Computer Science and Technology, 2010, 4(1): 89-96. (中文核心期刊)