个人信息
Personal information
教授 博士生导师 硕士生导师
性别：男
在职信息：在职
所在单位：材料科学与工程学院
学历：研究生(博士)毕业
学位：工学博士学位
学科：材料加工工程- [1] Chen, Guang ; Liu, Li; Silberschmidt, Vadim V.; Liu, Changqing; Wu, Fengshun; Chan, Y.C.. Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient. Journal of Materials Science: Materials in Electronics, v 29, n 7, p 5253-5263, April 1, 2018.[J].
- [2] Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y.C.; Tang, Zirong; Wu, Fengshun. An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder. Soldering and Surface Mount Technology, v 28, n 2, p 84-92, 2016.
- [3] Peng, Hao; Chen, Guang; Mo, Liping; Chan, Y.C.; Wu, Fengshun; Liu, Hui. An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints. Journal of Materials Science: Materials in Electronics, v 27, n 9, p 9083-9093, September 1, 2016.
- [4] Chen, Guang ; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. Journal of Alloys and Compounds, v 656, p 500-509, January 25, 2016.
- [5] Chen, Guang; Wu, Fengshun; Liu, Changqing; Xia, Weisheng; Liu, Hui. Effects of fullerenes reinforcement on the performance of 96.5Sn-3Ag-0.5Cu lead-free solder. Materials Science and Engineering A, v 636, p 484-492, June 01, 2015.
- [6] Chen, Guang ; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun. Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing. Journal of Alloys and Compounds, v 685, p 680-689, November 15, 2016.
- [7] Chen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun. Retained ratio of reinforcement in SAC305 composite solder joints: Effect of reinforcement type, processing and reflow cycle. Soldering and Surface Mount Technology, v 28, n 3, p 159-166, 2016.
- [8] Chen, Guang; Liu, Li; Du, Juan; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun. Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles. Journal of Materials Science, v 51, n 22, p 10077-10091, November 1, 2016.
- [9] L. Mo, Z. Chen, F. Wu, and C. Liu. Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal condition. Intermetallics, 2015, Vol.66, pp: 13-21. （SCI期刊）.
- [10] Liping Mo, Chaowei Guo, Zheng Zhou, Fengshun Wu, Changqing Liu. Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test. Journal of Materials Science: Materials in Electronics, 2018. 29(7):100-108. https://doi.org/10.1007/s10854-018-9293-8. (SCI 期刊).[J].
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