Indexed by: Article

Correspondence Author: Xianfei,Xie,Xianfei,Xie

Co-author: Xie_Xianfei,Sun_Changping,Xia_Chunyan,Zhang_Qiang,Tong_Yong,Liu_Pan,Jiang_Lidan,Yu_Kexun,Guo_Songlin,Changping,Chunyan,Qiang,Yong,Pan,Lidan,Kexun,Songlin,Xianfei;,Xianfei,Xie,Changping;,Sun,Chunyan;,Xia,Qiang;,Zhang,Yong;,Tong,Pan;,Liu,Lidan;,Jiang,Kexun;,Yu,Songlin;,Guo

Journal: IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS

Document Type: J

Volume: 59

Issue: 1

DOI number: 10.1109/TIA.2022.3208526

Date of Publication: 2023-01-01

Impact Factor: 4.198