论文类型：期刊论文
合写作者：Mingming Fan, Changzhu Yang*, Wenhong Pu, Jingdong Zhang*
发表刊物：Materials Science in Semiconductor Processing
收录刊物：SCI
卷号：17
页面范围：104-109
发表时间：2014-01-01
发布期刊链接：https://www.sciencedirect.com/science/article/pii/S1369800113002710
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