·Paper Publications
Guan Rongfeng, Gan Zhiyin, Zhu Fulong, Liu Sheng, Wang Xuefang, “Anodic bonding study on vacuum micro sealing cavity”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-4, 2006. (EI, DOI: 10.1109/ICEPT.2006.359851)
Release time:2018-09-19 Hits:
Correspondence Author: Guan Rongfeng
-
Pre One:：
Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Huang Dexiu, “Study on plasma cleaning and strength of wire bonding”, 2004 International Conference on the Business of Electronic Product Reliability and Liability ( EPRL), p65-71, 2004.( EI,)
-
Next One:：
陈四海, 汪殿民, 朱福龙, 徐涌, 易新建. 微型柔性剪切应力传感器的制作研究. 传感器技术, 2005(8) , 81-85