·Paper Publications
Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Huang Dexiu, “Study on plasma cleaning and strength of wire bonding”, 2004 International Conference on the Business of Electronic Product Reliability and Liability ( EPRL), p65-71, 2004.( EI,)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Wang Zhiyong, Zhu Fulong, ZHANG Hong-hai, LIU Sheng, GUAN Rong-feng, “A Six-axis Mechanical Tester for Microspecimens”, The 3rd International Symposium on Instrumentation Science and Technology(ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0535-0540.（ISTP）
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Next One:：
Guan Rongfeng, Gan Zhiyin, Zhu Fulong, Liu Sheng, Wang Xuefang, “Anodic bonding study on vacuum micro sealing cavity”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-4, 2006. (EI, DOI: 10.1109/ICEPT.2006.359851)