·Paper Publications
Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7, 2005 6th International Conference on Electronics Packaging Technology, p1-5, 2005.(EI, DOI: 10.1109/ICEPT.2005.1564686)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Effects of Temperature and Strain Rate on Mechanical property of Sn96.5Ag3Cu0.5”, Journal of Alloys and Compounds, v438, n1-2, p100-105, 2007.( SCI, EI, DOI: 10.1016/j.jallcom.2006.08.009)
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Next One:：
Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, “Mechanical Properties of a Lead-Free Solder Alloys”, 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v 2005, p107-112, 2005.( EI, DOI: 10.1109/AGEC.2005.1452326)