·Paper Publications
Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Effects of Temperature and Strain Rate on Mechanical property of Sn96.5Ag3Cu0.5”, Journal of Alloys and Compounds, v438, n1-2, p100-105, 2007.( SCI, EI, DOI: 10.1016/j.jallcom.2006.08.009)
Release time:2018-09-19 Hits:
Indexed by: Journal paper
Included Journals: EI、SCI
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Pre One:：
Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “the Effect of Temperature and Strain Rate On the Tensile properties of a Sn99.3Cu0.7(Ni) Lead-free Solder Alloy”, Microelectronic Engineering, v84, n1, p144-150, 2007.( SCI, EI, DOI: 10.1016/j.mee.2006.09.031)
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Next One:：
Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7, 2005 6th International Conference on Electronics Packaging Technology, p1-5, 2005.(EI, DOI: 10.1109/ICEPT.2005.1564686)