·Paper Publications
Included Journals: EI
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Pre One::
Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064)
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Next One::
Ke Duan, Fulong Zhu*, Kai Tang, Liping He, Yanming Chen, Sheng Liu, “Effect of Chirality and Number of Graphene Layers on the Mechanical Properties of Graphene-Embedded Copper Nanocomposites”, Computational Materials Science, v117, p294-299, 2016.(SCI, EI, DOI: 10.1016/j.commatsci.2016.02.007)