华中科技大学主页平台管理系统 ZHU FU LONG--英文主页-- Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064)

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2025-4-12，Saturday

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064)

Release time:2018-09-19 Hits:

Included Journals: EI

Pre One:：
Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, “Warpage measurement of silicon wafers of various bonding areas”, in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT-HDP.2012.6474814)
Next One:：
Ying Li, Fulong Zhu*, Yanming Chen, Ke Duan, Kai Tang, Sheng Liu, “Analysis of insertion force of electric connector based on FEM”, 2014 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA2014，p195-198, 2014. (EI, DOI: 10.1109/IPFA.2014.6898160)