华中科技大学主页平台管理系统 ZHU FU LONG--英文主页-- Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, “Warpage measurement of silicon wafers of various bonding areas”, in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT-HDP.2012.6474814)

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2025-4-12，Saturday

·Paper Publications

Current position: 英文主页 > Scientific Research > Paper Publications

Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, “Warpage measurement of silicon wafers of various bonding areas”, in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT-HDP.2012.6474814)

Release time:2018-09-19 Hits:

Included Journals: EI

Pre One:：
Wei Zhang, Fulong Zhu*, Honghai Zhang, Sheng Liu, “An Adjustable Sensitivity Shadow Moiré Technique for Surface Morphology Measurement”, Journal of Modern Optics, v61, n8, p641-649, 2014. (SCI, EI, DOI: 10.1080/09500340. 2014. 904941)
Next One:：
Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064)