·Paper Publications
Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu, “Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics”, in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, p434-437, 2018. (EI, DOI:10.23919/ICEP. 2018. 8374341)
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Yixin Xu, Fulong Zhu*, Miaocao Wang, Xiaojian Liu, Sheng Liu, “Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures”, in 19th International Conference on Electronic Packaging Technology, ICEPT 2018.
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Next One:：
Yongjun Pan, Fulong Zhu*, Jiajie Fan, Jiaquan Tao, Xinxin Lin, Fengren Wang and Lang Shi, “Investigation of mechanical properties of silicone/phosphor composite used in light emitting diodes package”, Polymers, v10, n2, p195, 2018. (SCI,EI, DOI: 10.3390/polym10020195)