·Paper Publications
Yixin Xu, Fulong Zhu*, Miaocao Wang, Xiaojian Liu, Sheng Liu, “Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures”, in 19th International Conference on Electronic Packaging Technology, ICEPT 2018.
Release time:2018-09-19 Hits:
Included Journals: EI
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Pre One:：
Fulong Zhu*, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu, “Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique”, IEEE Access, v6, p33099-33110, 2018. (SCI,EI, DOI:10.1109/ACCESS. 2018. 2842199,*Corresponding author)
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Next One:：
Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu, “Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics”, in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, p434-437, 2018. (EI, DOI:10.23919/ICEP. 2018. 8374341)