Release time:2021-07-08 Hits:
- Indexed by:Journal paper
- First Author:Liu Dandan
- Correspondence Author:WU WENJIE,tuliangcheng
- Co-author:LIU HUAFENG,LIU JIN QUAN,Fangjing Hu,FAN JI
- Journal:Sensors
- Included Journals:SCI、SSCI
- Discipline:Engineering
- First-Level Discipline:Electronic Science And Technology
- Document Type:J
- Volume:20
- Key Words:MEMS accelerometer; capacitive transducer; temperature gradient; bonding warpage
- DOI number:10.3390/s20041186
- Date of Publication:2020-02-19
- Abstract:Capacitive MEMS accelerometers with area‐variable periodic‐electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding‐induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices, has a negative influence on the precise control of the interelectrode
spacing that is essential to the sensitivity of accelerometers. In this work, we propose the theory, simulation and experiment of a method that can alleviate both the stress and the warpage by
applying different bonding temperature on the bonded slices. A quasi‐zero warpage is achieved experimentally, proving the feasibility of the method. As a benefit of the flat surface, the spacing of the capacitive displacement transducer can be precisely controlled, improving the self‐noise of the accelerometer to 6 ng/√Hz @0.07 Hz, which is about two times lower than that of the accelerometer using a uniform‐temperature bonding process.
