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A review of SiC power module packaging: Layout, material system and integration. Chen, C., Luo, F., Kang, Y. CPSS Transactions on Power Electronics and Applications, 2017
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上一条：An SiC-based half-bridge module with an improved hybrid packaging method for high power density applications. Chen, C.; Chen, Y.; Li, Y.; Huang, Z.; Liu, T.; Kang, Y. IEEE Transactions on Industrial Electronics, 2017
下一条：Investigation, evaluation, and optimization of stray inductance in laminated busbar. Chen, C.; Pei, X.; Chen, Y.; Kang, Y. IEEE Transactions on Power Electronics, 2014