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Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure. Chen, C.; Huang, Z.; Chen, L.; Tan, Y.; Kang, Y.; Luo, F. IEEE Transactions on Power Electronics,2018
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上一条：Design of a high-efficiency, high specific-power three-level T-type power electronics building block for aircraft electric-propulsion drives. Deshpande, A., Chen, Y., Narayanasamy, B., Yuan, Z., Chen, C., Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019
下一条：On the practical design of a high power density SiC single-phase uninterrupted power supply system. Chen, C.; Chen, Y.; Tan, Y.; Fang, J.; Luo, F.; Kang, Y. IEEE Transactions on Industrial Informatics, 2017