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Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure. Chen, C.; Huang, Z.; Chen, L.; Tan, Y.; Kang, Y.; Luo, F. IEEE Transactions on Power Electronics,2018
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上一条：Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure. Chen, C.; Huang, Z.; Chen, L.; Tan, Y.; Kang, Y.; Luo, F. IEEE Transactions on Power Electronics,2018
下一条：An SiC-based half-bridge module with an improved hybrid packaging method for high power density applications. Chen, C.; Chen, Y.; Li, Y.; Huang, Z.; Liu, T.; Kang, Y. IEEE Transactions on Industrial Electronics, 2017