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A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure. Huang, Z.; Chen, C.; Xie, Y.; Yan, Y.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019
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上一条：A High Efficiency Model-Based Adaptive Dead-Time Control Method for GaN HEMTs Considering Nonlinear Junction Capacitors in Triangular Current Mode Operation. Zhang, Y.; Chen, C.; Liu, T.; Xu, K.; Kang, Y.; Peng, H. IEEE Journal of Emerging and Selected Topics in Power Electronics,2019
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