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A High Power Density Double-side-end Double Sided Bonding SiC Half-bridge Power Module. Yiyang Yan; Cai Chen; Zongheng Wu;Jiajia Guan;Jianwei Lv;Yong Kang. IEEE Transactions on Transportation Electrification, 2023
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上一条:A Stress-Relieved Method based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate. Chi Zhang; Cai Chen; Yi Zhang; Yiyang Yan; Yong Kang. IEEE Acces, 2023
下一条:A Dynamic Current Balancing Method for Paralleled SiC MOSFETs Using Monolithic Si-RC Snubber Based on a Dynamic Current Sharing Model. Lv, J.; Chen, C.; Liu, B.; Yan, Y.; Kang, Y. IEEE Transactions on Power Electronics, 2022