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A Stress-Relieved Method based on Bottom Pattern Design Considering Thermal and Mechanical Behavior of DBC Substrate. Chi Zhang; Cai Chen; Yi Zhang; Yiyang Yan; Yong Kang. IEEE Acces, 2023
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上一条：Analysis of Dead-Time Energy Loss in GaN-based TCM Converters with an Improved GaN HEMT Model. Zhang, Y., Xu, W., Xie, Y., Liu, T., Wu, Z., Chen, C, Kang, Y. IEEE Transactions on Power Electronics, 2023
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