Dai Ling

·Awards and Honours

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Release time:2018-09-16  Hits:

Title of Achievement: 科技进步奖

Affiliation of Participants: 华中科技大学

Granted by: 教育部

Type of Outcome: 硬件装置

Level of Award: Province/ city

Grade of Award: First prize

Date of Award: 2017-11-30

Number of Participants: 13