个人信息
Personal information
教授 博士生导师 硕士生导师
性别：男
在职信息：在职
所在单位：材料科学与工程学院
学历：研究生(博士)毕业
学位：工学博士学位
学科：材料加工工程
收录刊物：SCI
-
上一条：
Chen, Guang ; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.. Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheets. Journal of Alloys and Compounds, v 656, p 500-509, January 25, 2016
-
下一条：
Chen, Guang ; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun. Performance of Sn-3.0Ag-0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing. Journal of Alloys and Compounds, v 685, p 680-689, November 15, 2016