王超

个人信息Personal Information

研究员(自然科学)   博士生导师   硕士生导师  

性别:男

在职信息:在职

所在单位:光学与电子信息学院

学历:研究生(博士)毕业

学位:工学博士学位

毕业院校:南洋理工大学

学科:微电子学与固体电子学
电路与系统

论文成果

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Integrated Wideband Chip-Scale RF Transceivers for Radar Sensing and UWB Communications: A Survey

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论文类型:期刊论文

第一作者:Z. Fang

通讯作者:C. Wang* and Y. Zheng

合写作者:W. Wang, J. Wang, B. Liu, K. Tang, L. Lou, C-H Heng

发表刊物:IEEE Circuits and Systems Magazine (CAS-M)

收录刊物:SCI

文献类型:J

卷号:22

期号:1

页面范围:40-76

DOI码:10.1109/MCAS.2022.3142689

发表时间:2022-02-24

影响因子:4.04

摘要:With the rapid development of semiconductor technologies, the wideband transceiver is in the trend to be integrated on-chip with compact size and low power consumption. This survey investigates the integrated wideband chip-scale RF transceivers for radar applications including imaging, multimodal sensing, and recognition on gaits, where frequency modulated continuous wave (FMCW) radar sensors are investigated in detail. Besides radar sensing, integrated wideband RF transceivers for accurate localization and efficient communications with spectrum sharing are discussed, in which the integrated wideband transceiver techniques for ultra-wideband (UWB) communications are highlighted. The compact and efficient antenna designs for integrated wideband RF transceivers are discussed. Furthermore, leveraging the artificial intelligence (AI)-enhanced signal processing techniques, edge devices with energy-efficient integrated RF transceivers can ensure precise localization and realize versatile sensing to empower accurate health status monitoring, intelligent robots, gesture recognition, and enhanced communications. We envisioned the future integrated wideband RF transceiver development trends, where the promising tera-Hertz (THz) integrated transceiver techniques are discussed. Notably, the wideband integrated RF transceiver technique is promising to enable efficient, flexible, and seamless communications and sensing for the future-generation intelligent Internet of Everything (IoE) applications.

发布期刊链接:https://ieeexplore.ieee.org/document/9722943