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Rong Chen

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一种用于高温3D打印的自适应平台

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Affilication of Author(s):华中科技大学

School Sign:华中科技大学

Patent Applicant:邢泽华,胡镔,陈蓉,徐子又,李邹霜,LI YUN,曹坤,杨惠之,陈蓉

Disigner of the Invention:华中科技大学

Type of Patent:Invent

Authorization number:201810293276.1

Number of Inventors:5

Authorization Date:2018-03-30

First Author:Rong Chen,陈蓉

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