华中科技大学主页平台管理系统 Huang YongAn--iFLEX@HUST--Paper Publications

中文

Huang YongAn

Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates

Professional Title:Professor
Gender:Male
Status:Employed
Department:智能制造装备与技术全国重点实验室
Education Level:Postgraduate (Doctoral)
Degree:Doctoral Degree in Engineering
Alma Mater:Northwestern Polytechnical University

MORE

Paper Publications iFLEX@HUST >> Scientific Research >> Paper Publications: Jian Kui Chen, Yong An Huang, Zhou Ping Yin.Analysis of the Effect of Idle Rollers on Tension Vibration in Discontinuous Web Transport Systems.Advanced Engineering Forum,2012,61-67

Peng Bo,Peng Bo; Huang YongAn ; Yin Zhouping ; Xiong Youlun.Competing Fracture Modeling of Thin Chip Pick-Up Process.IEEE Transactions on Components Packaging and Manufacturing Technology,2012,(7):1217 - 1225

王小梅,王小梅; 黄永安; 布宁斌; 段永青; 尹周平.静电纺丝制备微纳纤维的形貌表征与影响机理分析.科学通报,2012,(10):860-866

Hu XiangTao,Hu XiangTao; Huang YongAn; Yin ZhouPing; Xiong YouLun.Driving force planning in shield tunneling based on Markov decision processes.SCIENCE CHINA-TECHNOLOGICAL SCIENCES,2012,(4):1022-1030

XiaoMei WANG, YongAn HUANG, NingBin BU, YongQing DUAN, ZhouPing YIN.Morphology characterization and influential mechanism analysis of electrospun micro/nano-fiber.Chinese Science Bulletin,2012,(10):860-866

Li Wenlong,Li Wenlong; Yin Zhouping ;Yong-an Huang ; Xiong Youlun.Automatic registration for 3D shapes using hybrid dimensionality-reduction shape descriptions.Pattern Recognition,2011,(12):2926-2943

Peng Bo,Peng Bo; Huang YongAn ; Yin ZhouPing ; Xiong YouLun.Analysis of interfacial peeling in IC chip pick-up process.Journal of Applied Physics,2011,(7):1-7

Huang YongAn,Huang YongAn ; Chen Jiankui; Yin Zhouping; Xiong Youlun.Roll-to-Roll Processing of Flexible Heterogeneous Electronics with Low Interfacial Residual Stress.IEEE Transactions on Components Packaging and Manufacturing Technology,2011,(9):1368-1377

Bo Peng, YongAn Huang, ZhouPing Yin, YouLun Xiong.On the analysis of dynamic effect in the die pick-up process.Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 12th International Conference on,2011,1-4

Wenlong Li, Zhouping Yin, Yongan Huang, Tong Wu, Youlun Xiong.Tool path generation for triangular meshes using least-squares conformal map.International Journal of Production Research,2011,(12):3653-3667

total140 12/14
first previous next last Page; GET MORE