Guanglan Liao
·Paper Publications
A novel approach for flip chip solder joint inspection based on pulsed phase thermography , NDT & E International, 2011.10, 44(6): 484~489
Release time:2018-03-22 Hits:
First Author: Lu, Xiangning
Correspondence Author: Liao, Guanglan.
Co-author: Xiangning; Zha, Zheyu; Xia, Qi; Shi, Tielin, Liao