Guanglan Liao
·Paper Publications
- [1] Lu, Xiangning, Xiangning; Zha, Zheyu; Xia, Qi; Shi, Tielin, Liao.Liao, Guanglan..A novel approach for flip chip solder joint inspection based on pulsed phase thermography , NDT & E International, 2011.10, 44(6): 484~489.
- [2] binder-free anodes for high-performance Li-ion batteries , Journal of Materials Chemistry A, 2014, 2(11): 3741~3748.
- [3] Technology-Materials Science Edition, 2014.4, 29(2): 250~255.
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