陈材
- On the practical design of a high power density SiC single-phase uninterrupted power supply system. Chen, C.; Chen, Y.; Tan, Y.; Fang, J.; Luo, F.; Kang, Y. IEEE Transactions on Industrial Informatics, 2017.
- An SiC-based half-bridge module with an improved hybrid packaging method for high power density applications. Chen, C.; Chen, Y.; Li, Y.; Huang, Z.; Liu, T.; Kang, Y. IEEE Transactions on Industrial Electronics, 2017.
- A review of SiC power module packaging: Layout, material system and integration. Chen, C., Luo, F., Kang, Y. CPSS Transactions on Power Electronics and Applications, 2017.
- Investigation, evaluation, and optimization of stray inductance in laminated busbar. Chen, C.; Pei, X.; Chen, Y.; Kang, Y. IEEE Transactions on Power Electronics, 2014.