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陈材
个人信息Personal Information
教授
博士生导师
硕士生导师
性别：男
在职信息：在职
所在单位：电能高密度转换全国重点实验室
学历：研究生(博士)毕业
学位：工学博士学位
毕业院校：华中科技大学
学科：电力电子与电力传动
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Mitigation measures of the electric field in the medium voltage power module: Effect of voltage types and recommendations. Huang, Z.; Chen, C. ; Kang, Y.; Munk‐Nielsen, S.; Uhrenfeldt, C. High Voltage, 2021.
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Investigation on Ultralow Turn-off Losses Phenomenon for SiC MOSFETs With Improved Switching Model. Xie, Y.; Chen, C. ; Yan, Y.; Huang, Z.; Kang, Y. IEEE Transactions on Power Electronics, 2021.
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Reflected wave phenomenon in SiC motor drives: consequences, boundaries, and mitigation. Narayanasamy, B., Sathyanarayanan, A. S., Luo, F., Chen, C. IEEE Transactions on Power Electronics, 2020.
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GaN-Based Megahertz Single-Phase Inverter With a Hybrid TCM Control Method for High Efficiency and High-Power Density. Liu, T.; Chen, C. ; Xu, K.; Zhang, Y.; Kang, Y. IEEE Transactions on Power Electronics, 2020.
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Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing. Yuan, Z., Peng, H., Deshpande, A., Narayanasamy, B., Emon, A. I., Luo, F.,Chen, C. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019.
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High frequency conducted EMI investigation on packaging and modulation for a Sic-based high frequency converter. Xie, Y.; Chen, C. ; Huang, Z.; Liu, T.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019.
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A High Efficiency Model-Based Adaptive Dead-Time Control Method for GaN HEMTs Considering Nonlinear Junction Capacitors in Triangular Current Mode Operation. Zhang, Y.; Chen, C.; Liu, T.; Xu, K.; Kang, Y.; Peng, H. IEEE Journal of Emerging and Selected Topics in Power Electronics,2019.
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A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure. Huang, Z.; Chen, C.; Xie, Y.; Yan, Y.; Kang, Y.; Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019.
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Design of a high-efficiency, high specific-power three-level T-type power electronics building block for aircraft electric-propulsion drives. Deshpande, A., Chen, Y., Narayanasamy, B., Yuan, Z., Chen, C., Luo, F. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019.
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Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure. Chen, C.; Huang, Z.; Chen, L.; Tan, Y.; Kang, Y.; Luo, F. IEEE Transactions on Power Electronics,2018.
