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Rong Chen

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一种柔性器件的超薄复合封装薄膜结构及制备方法

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Affilication of Author(s):华中科技大学

School Sign:华中科技大学

Patent Applicant:杨惠之,LI YUN,曹坤,Bin Shan,李邹霜,陈蓉

Disigner of the Invention:华中科技大学

Type of Patent:Invent

Authorization number:ZL201910413501.5

Number of Inventors:6

Authorization Date:2019-05-17

First Author:Rong Chen

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